Rogue Valley Microdevices offers E-Beam Evaporation of metal stacks including but not limited to Ti/Au, Ti/Pt, Cr/Au, and Cr/Pt. Our E-Beam Evaporation process provides excellent film thickness uniformity. Evaporation is done at low temperatures that will not damage photoresist for metal lift-off. Our process capabilities allow us to deposit up to six different materials... (read more)

Rogue Valley Microdevices offers Nitrogen, Nitrogen/Oxygen, and Forming Gas Annealing.

Nitrogen Annealing after PECVD deposition can be important if wafers are exposed to high temperatures later on in the process. Adding an Anneal will densify PECVD films to make them more stable during thermal cycling. (read more)

Rogue Valley Microdevices offers Nitrogen, Nitrogen/Oxygen, and Forming Gas Annealing.

Nitrogen Annealing after PECVD deposition can be important if wafers are exposed to high temperatures later on in the process. Adding an Anneal will densify PECVD films to make them more stable during thermal cycling. (read more)

Rogue Valley Microdevices offers Nitrogen, Nitrogen/Oxygen, and Forming Gas Annealing.

Nitrogen Annealing after PECVD deposition can be important if wafers are exposed to high temperatures later on in the process. Adding an Anneal will densify PECVD films to make them more stable during thermal cycling. (read more)

Rogue Valley Microdevices foundry can provide Sputtered Metals and Sputtered Dielectrics. Our sputtering capabilities include PVD Metals, PVD Dielectrics, and Evaporated Metals including but not limited to Copper, Aluminum, Silicon, Silicon Nitride, and Evaporated precious metals on wafers sizes 50mm to 300mm in diameter. (read more)

Rogue Valley Microdevices foundry can provide Sputtered Metals and Sputtered Dielectrics. Our sputtering capabilities include PVD Metals, PVD Dielectrics, and Evaporated Metals including but not limited to Copper, Aluminum, Silicon, Silicon Nitride, and Evaporated precious metals on wafers sizes 50mm to 300mm in diameter. (read more)

Rogue Valley Microdevices foundry can provide Sputtered Metals and Sputtered Dielectrics. Our sputtering capabilities include PVD Metals, PVD Dielectrics, and Evaporated Metals including but not limited to Copper, Aluminum, Silicon, Silicon Nitride, and Evaporated precious metals on wafers sizes 50mm to 300mm in diameter. (read more)

Rogue Valley Microdevices provides PVD Metals including sputtered Copper, sputtered Tantalum, sputtered Titanium, sputtered Tungsten, sputtered Nickel, sputtered Chrome, and sputtered Aluminum. Our process has an in-situ RF etch that ensures good film adhesion and Ohmic contact to conductive layers. We can provide the metal barrier layers and dielectric films on wafers sizes 50mm to 300mm. (read more)

Rogue Valley Microdevices provides PVD Metals including sputtered Copper, sputtered Tantalum, sputtered Titanium, sputtered Tungsten, sputtered Nickel, sputtered Chrome, and sputtered Aluminum. Our process has an in-situ RF etch that ensures good film adhesion and Ohmic contact to conductive layers. We can provide the metal barrier layers and dielectric films on wafers sizes 50mm to 300mm. (read more)

MicroGrid® precision-expanded foils from Dexmet are used in batteries, electronics, aerospace, medical, packaging, and wherever mesh and perforated foils with high precision, mechanical and electrical properties or EMI/ RFI shielding capabilities are required. (read more)