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Keep current on the latest products, new suppliers, and technical articles of interest to you. (See Topics) |
Products/Services for laser etching wafer
Instruments such as quartz crystal microbalance (QCM) monitors, ellipsometers, RHEED systems, imaging stations, CD-SEMs, ion mills, C-V systems specifically designed for wafer metrology or in-situ monitoring of thin film parameters during thin film or semiconductors wafer processing. Search by Specification | Learn More about Wafer and Thin Film Instrumentation
Solid state lasers use a transparent substance (crystalline or glass) as the active medium, doped to provide the energy states necessary for lasing. Solid state lasers are used in both low and high power applications. Search by Specification | Learn More about Solid State Lasers
Thin film equipment uses vacuum processing for the modification of surfaces using CVD, PVD, plasma etching, and thermal oxidation or ion implantation. Search by Specification | Learn More about Thin Film Equipment
Laser marking and laser engraving services use a computer-controlled laser beam to discolor the surface of a component, or engrave it by vaporizing the material. Search by Specification | Learn More about Laser Marking and Laser Engraving Services
Lasers are devices that produce intense beams of monochromatic, coherent radiation. The word "laser" is an acronym for Light Amplification by Stimulated Emission of Radiation. Search by Specification | Learn More about Lasers
Carbon dioxide (CO2) lasers use the energy-state transitions between vibrational and rotational states of CO2 molecules to emit at long IR, about 10 µm, wavelengths. These lasers can maintain continuous and very high levels of power and are typically used in cutting, welding, etching, and marking applications. Search by Specification | Learn More about Carbon Dioxide (CO2) Lasers
Laser machining services use computer-controlled lasers to perform a variety of material removal processes. These lasers can be positioned and controlled with a high degree of accuracy, allowing for a variety of effects to be achieved. Search by Specification | Learn More about Laser Machining Services
...oxidation and diffusion, packaging and backend processing, photolithography, screen-printing, wafer bonding, and wet and chemical etching. Search by Specification | Learn More about MEMS Foundry
Laser mounts are devices that keep a laser in position on a optical table. Learn More about Laser Mounts
Laser optics, heads and beam delivery components are used in laser cutting machines, laser welding and marking systems. Search by Specification | Learn More about Laser Optics, Heads and Beam Delivery Components
Laser processing equipment uses high-powered lasers to cut, trim, perforate, weld, or join a variety of materials in plate or sheet form. Search by Specification | Learn More about Laser Processing Equipment
Laser engraving and laser marking machines use a high-powered laser to mark or scribe materials with text, images, patterns, and graduations. Search by Specification | Learn More about Laser Engraving and Laser Marking Machines
Marking services and engraving services mark and engrave products and parts. Services offered include laser marking and engraving, rotary engraving, sublimation, electro discharge machining, and embossing. Search by Specification | Learn More about Marking Services and Engraving Services
Diode lasers use light-emitting diodes to produce stimulated emissions in the form of coherent light output. They are also known as laser diodes. Search by Specification | Learn More about Diode Lasers
Laser welding services use high-powered laser welding equipment to fuse materials together. Search by Specification | Learn More about Laser Welding Services
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Wafer Measurement System MTI Instruments Inc.
Wafer Inspection Systems Olympus America Inc.
Thin Film Measurement System StellarNet, Inc.
Wafer Measurement System from MTI Instruments MTI Instruments Inc.
CC-10 Wide Range Vacuum Gauge Televac
New Digital AVC Vacuum Gage Teledyne Instruments
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Product News for laser etching wafer
Laser Etching Microchannels
Laser etching microchannels using 3D micromachining with depth control in microns onto polycarbonate material. (read more)
Laser Etching, Engraving & Marking Services
Laser etching is a universal process used for many applications including part identification, serialization, bar-coding, calibration, and even the engraving of logos or labels. At Gateway Laser, they specialize in etching, engraving, and marking very small items like medical components, implants, and micro-electronics. (read more)
Non-Contact Wafer Thickness Gage
The Proforma 300 TM wafer thickness gage can be used to measure thickness, bow and TTV on all wafer materials including: silicon,gallium-arsenide,indium phosphide and germanium without recalibrating or electrically grounding the wafer. (read more)
PECVD SiC Thin Film for Silicon Wafers
Rogue Valley Microdevices offers PECVD Silicon Carbide (SiC), which is a single side deposition. This highly durable thin film can be deposited alone or within stack of PECVD Oxide and/or Nitride. PECVD Silicon Carbide is the perfect choice for use as a hard mask for bulk micromachining of your finished wafers. We are able to process wafer diameters of 50mm up to 300mm. (read more)
PECVD Silicon Carbide (SiC) Film for 2"-12" wafers
Rogue Valley Microdevices is pleased to offer PECVD Silicon Carbide. This highly durable thin film can be deposited alone or within stack of PECVD Oxide and/or Nitride films. PECVD Silicon Carbide is the perfect choice for use as a hard mask for bulk micromachining. Rogue Valley Microdevices process all wafers and films in-house at our Medford, Oregon facility. (read more)
CO2 Laser Engraving, Marking & Cutting Systems
Epilog designs and sells a complete line of Laser Etching Equipment to work with a wide variety of materials. From our entry-level systems to our largest feature-filled systems, you're sure to find the right equipment for your needs. (read more)
Linear Encoders - Epilog Laser Systems
The Linear Encoders used on all Epilog Laser systems provide unmatched accuracy and precision in engraving and cutting applications. (read more)
Sputtered PVD Metals available for Silicon Wafers
Rogue Valley Microdevices provides PVD Metals including sputtered Copper, sputtered Tantalum, sputtered Titanium, sputtered Tungsten, sputtered Nickel, sputtered Chrome, and sputtered Aluminum. Our process has an in-situ RF etch that ensures good film adhesion and Ohmic contact to conductive layers. We can provide the metal barrier layers and dielectric films on wafers sizes 50mm to 300mm. (read more)
PVD Sputtered Metals Available for Silicon Wafers
Rogue Valley Microdevices foundry can provide Sputtered Metals and Sputtered Dielectrics. Our sputtering capabilities include PVD Metals, PVD Dielectrics, and Evaporated Metals including but not limited to Copper, Aluminum, Silicon, Silicon Nitride, and Evaporated precious metals on wafers sizes 50mm to 300mm in diameter. (read more)
Full Services Laser House
Laser Services is a full-service laser house providing a wide variety of materials-processing services. With a fully equipped facility—including 25 modern CNC CO2 and YAG lasers— and over 40 trained professionals, we are your resource for laser scribing, etching, drilling, cutting and welding. (read more)
Conduct Research
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Fabrication of Nano-Structures using EB-Lithography and its Application to Long-Wavelength Quantum-Wire Lasers
It is important to fabricate high density and high uniformity nano-structures for the realization of quantum wire lasers. In this work, 1.5um-wavelength GalnAsP/InP quantum wire lasers were fabricated...(read more)
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Blasted away
Abrasive etching is an economical way to precision machine ceramics and other brittle materials. The Photo-Machining Process from Ikonics Corp., Duluth Minn., simultaneously etched 0.012-in.-diameter...(read more)
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Silicon Wafers SERVICES: WAFER RECLAIM AND STRIPPING, SLICING, LAPPING, POLISHING, CLEANING AND INSPECTION, LASER MARKING WAFER RECLAIM AND STRIPPING, SLICING, See Polishing Corporation of America Information |
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Fabrication and optimization of wafer level SAW filter package... Fabrication and optimization of wafer level SAW filter package using laser via drilling |
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Test vehicle for a wafer-scale thermal pixel scene simulator Test vehicle for a wafer-scale thermal pixel scene simulator |
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Etching Advances: SPIE Newsroom: SPIE.org Etching is not dependent on the crystallographic plane of the semiconductor wafer, so devices can be optimally located. |
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Laser alignment strictness for optical diffraction effect in... Therefore, the key parameter of product wafer will be calculated via the laser onto the grating mark resulted in moire signal. |
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3-D Biomimetic Micro-Channel Network by Laser Direct Writing... 3. SEM images of laser machined micro channels on bare silicon wafer after chemical wet etching as a post process: 30% KOH etching for 10 min. (a), |
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Society of Manufacturing Engineers Laser Punches PCB Micro Vias Laser Punches PCB Micro Vias |
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MRS Website : RTP Temperature Measurements Using Si Grating... RTP Temperature Measurements Using Si Grating Prepared by Laser Ablation for Large Diameter Wafer Applications See Materials Research Society Information |
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NIST Reacting Flows Group Showcase (24) Planar Laser Induced Fluorescence (PLIF) Image of CF2 in a Parallel Plate Plasma Etching Reactor |
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PHYSICS LAB: TECH. ACTIVITIES 1997 Div 848 A laser ionization method has been developed to detect the silicon chloride radical products during etching. |
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